Changxin Begins Small-Scale Production of HBM3E, Plans to Expand Output by 2027

Changxin Storage has started small-scale production of HBM3E and plans to expand output in 2027. HBM is a high-speed memory used for AI chips, responsible for fast data transmission. HBM2 and above products have been a shortcoming for domestic AI chips. Domestic chip teams such as Cambricon and Alibaba's T-head are testing Changxin's HBM, and if progress goes well, it could be applied to products as early as next year. HBM3E is the memory used by NVIDIA's H200 and Blackwell, and Changxin is currently only one generation behind SK Hynix, Samsung, and Micron's HBM4. Despite starting small-scale production, Changxin's HBM3E still faces issues with low yield rates, speed, and reliability. SK Hynix began mass production of HBM3E as early as 2024, and the three major manufacturers have entered the HBM4 stage and started sampling HBM4E. Changxin has crossed the hurdle of "whether it can be produced," and now needs to improve yield rates and output.

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